Efficient Automatic Single Arm PCB Copper Plating Line With Real Time Monitoring Function

The single-arm design features advanced robotic technology for accurate movement and positioning, ensuring even and consistent copper coating across all PCBs. This automation reduces manual handling errors while optimizing facility space for both small-scale and large-scale production.

Integrated sensors monitor critical parameters including copper concentration, current density, temperature, and plating solution flow rate. The system automatically adjusts plating parameters to maintain optimal conditions, ensuring consistent, high-quality PCB production.

The optimized plating bath chemistry and electrical parameters enable rapid copper deposition without quality compromise, meeting tight production deadlines while maintaining superior plating results.

Advanced power management and temperature control systems minimize energy consumption while maintaining optimal plating conditions, reducing both environmental impact and operational costs.

The user-friendly interface allows easy programming, parameter adjustment, and real-time alerts, reducing training requirements while ensuring seamless operation.